IOT传感器创新论坛
华东光电集成器件研究所
副总、研究员
展明浩,13909656291,现任华东光电集成器件研究所副总、研究员。安徽北方芯动联科微系统技术有限公司副总经理,国家地方MEMS工程实验室主任,安徽省MEMS工程实验室主任、省MEMS工程中心副主任,合肥工业大学研究生导师,蚌埠市首批“3221”MEMS产业创新团队带头人,安徽省“115”产业创新团队-MEMS产业创新团队带头人。2014年入选安徽省战略性新兴产业技术领军人才。2015年入选安徽省高层次科技人才团队。现从事半导体集成电路、微机械电子(MEMS)惯性传感器、图像传感器、微波固态功率器件等研究和产业化。
TBD
MEMSIC
Vice President of Product&Marketing
Sam.Lu(MEMSIC Vice President of Product&Marketing)
Worked at SEIKO EPSON (semiconductor business), Philips Mobile Display, since 2004, successively served as Micron Technology Asia Pacific Marketing Director, Aptina China General Manager, InvenSense China General Manager, HiDM Imaging Solutions Division President;
Over 20 years of experience in semiconductor, software and hardware solutions, including more than 15 years of diversified team management experience, Asia-Pacific and China business management experience;
Born in 1973, Bachelor Degree in Industrial Automation, Shanghai Universit.
On the requirements of modern wafer bonding
SUSS MicroTec (Shanghai) Co., Ltd.
Specialist Bonder Equipment
Max.Cai is bonder equipment specialist of SUSS MircoTec. He joined SUSS on 2006, and since then focused on wafer bonding technology. He worked with SUSS global wafer bonding specialist team to support semiconductor foundries, institutes and universities in China, helped customers to settle and develop their wafer bonding technology in various of different applications for decade.
Technology driven MEMS applications and supports for IoT waves on social activities
Wuxi Will Semiconductor Co., Ltd.
Co-founder, CTO
Cayman Van received his bachelor of engineering degree in 2005 in Tsinghua University, while received his master & Ph. D degree of engineering degree in 2010 in Tsinghua University, senior engineer. His research interest is in MEMS technologies, including MEMS inertial technologies studies for over 9 years and MEMS microphone technologies studies for over 8 years. Dr. Van has published over 20 papers, while holds over 80 patents. He is also member of Editorial Committee for the treatise “Inertial Technical Manual” which published in 2013, as well as member of “Intelligence Xinwu Expert Tank” in Wuxi High-Tech Zone, and is now co-founder & CTO of Wuxi Will Semiconductor Co., Ltd.
MEMS的机遇与挑战
中芯绍兴
CEO
复旦大学应用物理学士,中欧国际工商学院EMBA
23年集成电路工作经验,14年华虹NEC,9年中芯国际
历任华虹NEC工业工程主管、计划部总监
中芯国际企业规划中心资深总监
5G时代的射频滤波器
杭州左蓝微电子技术有限公司
总经理
张树民,杭州左蓝微电子技术有限公司总经理,乔治华盛顿大学计算机工程专业博士,浙江省海外 高层次人才计划特聘专家、中国计算机学会青年计算机科技论坛委员(CCF YOCSEF)、IEEE高级会员 、ACM会员、美国项目管理研究所会员。同时,担任乔治华盛顿大学兼职教授、东南大学特聘教授。
张树民博士曾经先后在国内外知名领先企业担任高级工程师、研发副总裁和首席科学家,是半导体、通信电子领域资深专家,主要从事射频微机电系统装置的建模、实现和应用,如电压控制振荡器、混频器、低损耗滤波器、低噪声放大器及其在软件无线电中的应用系统等领域都有建树和心得,主要研发成果包括:温度补偿型声学双工器;用于基站等通信领域的创新工艺的射频MEMS开关;卫星通讯调制解调器;全球领先的卫星手机、高频声表面波滤波器、薄膜体声波谐振器等。
Hall A
Location: A101-104
28th-30th, Oct.Location: B1Moderator: Yong Cai
28th-30th, Oct.Location: B1Moderator: Baoshun Zhang/Dawei Wang
28th-30th, Oct.Location: B1Moderator: Weiping Li
Conference registering fee includes: Lunch and tea break during the conference, conference documents and souvenirs
Dinner and accommodation fee are not included