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Speakers

Speaker:展明浩
  • Topic:

    IOT传感器创新论坛

  • Institution:

    华东光电集成器件研究所

  • Position:

    副总、研究员

  • resume:

    展明浩,13909656291,现任华东光电集成器件研究所副总、研究员。安徽北方芯动联科微系统技术有限公司副总经理,国家地方MEMS工程实验室主任,安徽省MEMS工程实验室主任、省MEMS工程中心副主任,合肥工业大学研究生导师,蚌埠市首批“3221”MEMS产业创新团队带头人,安徽省“115”产业创新团队-MEMS产业创新团队带头人。2014年入选安徽省战略性新兴产业技术领军人才。2015年入选安徽省高层次科技人才团队。现从事半导体集成电路、微机械电子(MEMS)惯性传感器、图像传感器、微波固态功率器件等研究和产业化。

Speaker:Sam.Lu
  • Topic:

    TBD

  • Institution:

    MEMSIC

  • Position:

    Vice President of Product&Marketing

  • resume:

    Sam.Lu(MEMSIC Vice President of Product&Marketing)
    Worked at SEIKO EPSON (semiconductor business), Philips Mobile Display, since 2004, successively served as Micron Technology Asia Pacific Marketing Director, Aptina China General Manager, InvenSense China General Manager, HiDM Imaging Solutions Division President;
    Over 20 years of experience in semiconductor, software and hardware solutions, including more than 15 years of diversified team management experience, Asia-Pacific and China business management experience;
    Born in 1973, Bachelor Degree in Industrial Automation, Shanghai Universit.

Speaker:Max.Cai
  • Topic:

    On the requirements of modern wafer bonding

  • Institution:

    SUSS MicroTec (Shanghai) Co., Ltd.

  • Position:

    Specialist Bonder Equipment

  • resume:

    Max.Cai is bonder equipment specialist of SUSS MircoTec. He joined SUSS on 2006, and since then focused on wafer bonding technology. He worked with SUSS global wafer bonding specialist team to support semiconductor foundries, institutes and universities in China, helped customers to settle and develop their wafer bonding technology in various of different applications for decade.

Speaker:Cayman Van
  • Topic:

    Technology driven MEMS applications and supports for IoT waves on social activities

  • Institution:

    Wuxi Will Semiconductor Co., Ltd.

  • Position:

    Co-founder, CTO

  • resume:

    Cayman Van received his bachelor of engineering degree in 2005 in Tsinghua University, while received his master & Ph. D degree of engineering degree in 2010 in Tsinghua University, senior engineer. His research interest is in MEMS technologies, including MEMS inertial technologies studies for over 9 years and MEMS microphone technologies studies for over 8 years. Dr. Van has published over 20 papers, while holds over 80 patents. He is also member of Editorial Committee for the treatise “Inertial Technical Manual” which published in 2013, as well as member of “Intelligence Xinwu Expert Tank” in Wuxi High-Tech Zone, and is now co-founder & CTO of Wuxi Will Semiconductor Co., Ltd.

Speaker:赵奇
  • Topic:

    MEMS的机遇与挑战

  • Institution:

    中芯绍兴

  • Position:

    CEO

  • resume:

    复旦大学应用物理学士,中欧国际工商学院EMBA
    23年集成电路工作经验,14年华虹NEC,9年中芯国际
    历任华虹NEC工业工程主管、计划部总监
    中芯国际企业规划中心资深总监

Speaker:张树民
  • Topic:

    5G时代的射频滤波器

  • Institution:

    杭州左蓝微电子技术有限公司

  • Position:

    总经理

  • resume:

    张树民,杭州左蓝微电子技术有限公司总经理,乔治华盛顿大学计算机工程专业博士,浙江省海外 高层次人才计划特聘专家、中国计算机学会青年计算机科技论坛委员(CCF YOCSEF)、IEEE高级会员 、ACM会员、美国项目管理研究所会员。同时,担任乔治华盛顿大学兼职教授、东南大学特聘教授。
    张树民博士曾经先后在国内外知名领先企业担任高级工程师、研发副总裁和首席科学家,是半导体、通信电子领域资深专家,主要从事射频微机电系统装置的建模、实现和应用,如电压控制振荡器、混频器、低损耗滤波器、低噪声放大器及其在软件无线电中的应用系统等领域都有建树和心得,主要研发成果包括:温度补偿型声学双工器;用于基站等通信领域的创新工艺的射频MEMS开关;卫星通讯调制解调器;全球领先的卫星手机、高频声表面波滤波器、薄膜体声波谐振器等。

2019 Agenda arrangement

  • 22nd October
    9:00-17:30

    Hall A

    Conference Registration

  • 23rd October
    9:00-11:30

    Location: A101-104

    Opening ceremony and Plenary Speech of CHInano 2019

Conference Schedule

28th-30th, Oct.Location: B1Moderator: Yong Cai

Time
Speaker
Position/Institution
Topic
  • 13:30-13:45
    Chenghe Gong
    Executive Vice Secretary-General ,China Semiconductor Industry Association
    Opening Remarks
  • 13:45-14:10
    Jerry Liu
    EVP, SMEC
    Fabrication of MEMS in Intelligent Era
  • 14:10-14:35
    Hongjun Liu
    Deputy General Manager, China Wafer Level CSP Co., Ltd.
    Making More Senses of the Future World
  • 14:35-15:00
    Yuanfeng Chen
    Winfred PH.D Chief Hardware Architect, Alibaba Group-Alibaba
    The Way to IoT Smart Device
  • 15:00-15:20
    Tea Break & Exhibition
  • 15:20-15:45
    Kui Liu
    Technical Manager of Customer Engineering Department, CSMC Technologies Fab2 Co., Ltd.
    Introduction of CSMC's MEMS Foundry Business
  • 15:20-15:45
    Jianmin Wang
    Deputy General Manager, AAC Technologies
    Introduction of AAC Technologies's MEMS Business
  • 16:10-16:35
    Qingjie Ma
    Technical Director, MEMSRIGHT
    Build Innovation Ecosystem, Promote MEMS Industry Codevelopment
  • 16:35-17:00
    Shuying Ma
    Vice President of Research Institute (Kunshan) / R&D Director of TSV Program, Tianshui Huatian Technology Co., Ltd.
    Applications of 3D Wafer Level Packaging Technology in Sensors
  • 17:00-17:25
    Gary Li
    CEO, MEMSensing
    Emerging MEMS Industry in China - from a Domestic Startup's Perspective
  • 17:25-17:50
    Wang Yi
    CEO, MEMS Consulting
    The Status and Thinking of Solid-state Sensor Industry
  • 18:30-20:30
    Reception Dinner (Invitation Only) A101-A104

Conference Schedule

28th-30th, Oct.Location: B1Moderator: Baoshun Zhang/Dawei Wang

Time
Speaker
Position/Institution
Topic
  • 09:00-09:25
    Baoshun Zhang
    Director, Nano Fabrication Facility of Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), Chinese Academy of Sciences
    Micro- & nano-Devices Research and Fabrication
  • 09:25-09:50
    Yuping Tan
    Sales Director, Silex Microsystems
    The World's Leading Pure Play MEMS Foundry - Silex Microsystems
  • 10:15-10:30
    Tea Break & Exhibition
  • 09:50-10:15
    Koukou Suu
    Executive Officer&Senior Fellow ,ULVAC, Inc.
    Thin-film Processing Technologies of Piezoelectric Materials for IoT and AI Applications
  • 10:30-10:55
    Zhiguo Lai
    CTO, Suzhou HunterSun Electronics Co., Ltd.
    High Performance RF MEMS Filter
  • 10:55-11:20
    Yongxiang Wen
    Process Director, Hangzhou Silan Integrated Circuit Co., Ltd.
    Introduce of Silan MEMS Sensor Product
  • 11:20-11:45
    Dexin Wang
    Product R&D Director, Goertek
    Industrialization R & D and industrialization of MEMS sensors and SiP modules
  • 12:00-13:30
    Lunch & Exhibition
  • 13:30-13:55
    Lucy Huang
    CEO, Hanking Electronics (Liaoning) Co., Ltd.
    CEO, Hanking Electronics (Liaoning) Co., Ltd.
  • 13:55-14:20
    Qiushi Xie
    Deputy General Manager ETCH I, Beijing NAURA Microelectronics Equipment Co., Ltd.
    MEMS & 5G Etch Challenges and NAURA'S SOLUTION
  • 14:20-14:45
    David Wang
    CEO, Suzhou MiraMEMS Sensing Technology Co., Ltd.
    A New Wave of MEMS Sensor is Coming in IOT
  • 14:45-15:10
    Jian Zhu
    Principal Scientist of the 55th Research Institute of China Electronics Technology Group Corporation
    RF MEMS and RF Microsystem Process Technology
  • 15:10-15:40
    Tea Break & Exhibition
  • 15:40-16:05
    David Springer
    Product Manager of Release Etch Division, SPTS Technologies Ltd.
    MEMS Manufacturing Technologies to Carry MEMS into the Future
  • 16:05-16:30
    Songsheng Xue
    President & CEO, General Manager of Jiangsu MultiDimension Technology Co., Ltd.
    Tunneling Magnetoresistive Sensor and it's Applications
  • 16:30-16:55
    Ankun Mao
    China Regional Sales Manager, EVG
    EVG Advantage Wafer Bonding Technology at MEMS
  • 16:55-17:20
    Max Huang
    President of WaferPlus Technology Co., Ltd.
    Hybrid Micro-structuring, Now and Future
  • 17:20-17:45
    Kris Zhao
    IOT Research Center Senior Associate of CCID Consulting Co., Ltd.
    China MEMS Market Status and Trend

Conference Schedule

28th-30th, Oct.Location: B1Moderator: Weiping Li

Time
Speaker
Position/Institution
Topic
  • 09:00-09:25
    Haifeng Lin
    Vice President of MT Microsystems Co., Ltd.
    Opportunities for the Development of MEMS Manufacturing in the Intelligent Era
  • 09:25-09:50
    Xuhui Sun
    Principal Scientist of IDM Technology Inc.
    MEMS/Nano Gas Sensor Array Based E-nose
  • 09:50-10:15
    Cho Nan
    Director of Technology Development Division, Wintech Nano
    Breakthrough Nano Fluorescence Method for Characterising Leakage Channels in MEMS
  • 10:15-10:30
    Tea Break & Exhibition
  • 10:30-10:55
    Weiping Li
    General Manager of Nanjing Gova Technology Ltd.
    The Reliability Study of MEMS Sensor
  • 10:55-11:20
    Rui Liu
    General Manager of Suzhou Fuyi Electronic Technology Co., Ltd.
    3D System in Package based on Multi-materials
Stay tuned for the 2020 conference schedule, expected to go live in June

Conference Fee

Date
Regular Guests
Studentes
  • Before Sep.1
    2400
    1000
  • Before Oct. 20
    2600
    1400
  • On the date of the event
    3000
    1800

Meeting description:

Conference registering fee includes: Lunch and tea break during the conference, conference documents and souvenirs

Dinner and accommodation fee are not included

Review on 2019

往届回顾

  • Contact of Exhibition
    Lu Wei
    15050142680
    luw@nanopolis.cn
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