Meeting Schedule
China MEMS 2026 Manufacturing Conference
- Date: Oct. 21 Location: C1 Exhibition Hall Room 2, Suzhou International Expo Center
- Moderator: Nick Wan / Boon Keng Lok
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13:30-13:35Opening Remarks by Government Leader
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13:35-13:40Opening Remarks by the Representative of the Chair Unit of the MEMS Branch of the China Semiconductor Industry Association
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13:40-13:452025 China MEMS Top Ten Awards
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13:45-14:10AI Impact on Bosch MEMS Foundry Business
Stefan Majoni , Director of Bosch Foundry MEMS -
14:10-14:35AI Computing Chip Packaging and Glass Substrate Technology
Heng Wu , Senior Manager of Xiamen Sky Semiconductor Technology Co., Ltd. -
14:35-15:00AI & Edge Sensing in Semiconductor Manufacturing
Boon Keng Lok , Principal Program Manager, Strategy Asia of SEMI -
15:00-15:25Intelligent manufacturing solutions for advanced Photonics Testing and Packaging
Alex Cao , General Manager of ficonTEC China -
15:25-15:50Integrated Photonics — A Rising Star Industry
Mark Ding , General Manager of Suzhou Xingyue Photon Technology Co., Ltd. -
15:50-16:15MEMSensing Microelectronics' Gas Sensor Strategy
Gary Li , CEO of MEMSensing Microsystems (Suzhou, China) Co., Ltd. -
16:15-16:40Breaking Through to New Frontiers, Leaping into the Intelligent Era— Current Status and Future Trends of China’s MEMS Industry
Yanfang Li , Director of CCID Consulting IoT Industry Research Center
- Date: Oct. 22 Location: C1 Exhibition Hall Room 2, Suzhou International Expo Center
- Moderator: Bryan Yang
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08:40-09:05Advanced MEMS Manufacturing Practices for Automotive Intelligence, AI Terminals, and Intelligent Computing Optical Interconnects
Yangwen Yao , Director of MEMS R&D at United Nova Technology Co., Ltd. -
09:05-09:30Wafer-level Packaging Process for MEMS Chips
Bryan Yang , General Manager of R&D Department of China Wafer Level CSP Co., Ltd. -
09:30-09:55The Nano‑Eye: CD‑SEM Empowers Precision Manufacturing in the MEMS Domain
David Wang , CEO of Wellrun Microelectronics Technology Co., Ltd. -
09:55-10:20CSP Packaging for MEMS Products and Advanced Integrated Packaging Technology for Multi-Die Chiplets
Jianguo Wang , General Manager of Suzhou Quick Solution Electronics Co., Ltd. -
10:20-10:30Tea Break & Exhibition
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10:30-10:55A Few Updates and Growth of Silex Microsystems AB in 2026
Yuping Tan , Sales Director of Silex Microsystems AB -
10:55-11:20Advanced Semiconductor Bonding Integration Technology and Applications
Chao Guo , iSABers Group Co-Founder & Vice General Manager of iSABers Group Co., Ltd. -
11:20-11:45Application-Driven Foundry: Powering the Next Wave of MEMS Innovation
Timothy Lee Kok Beng , Director Business Development of SilTerra Malaysia Sdn Bhd -
11:45-12:10A Discussion on Advanced Packaging of Silicon Carbide Power Devices
Dongpo Chen , Executive Director of Institute of Wide‑Bandgap Semiconductor Materials and Devices, Ningbo Research Institute of Fudan University -
12:30-13:30Lunch & Exhibition
- Date: Oct. 22 Location: C1 Exhibition Hall Room 2, Suzhou International Expo Center
- Moderator: Yanming Xia
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13:00-13:25Promotion of Huaxin Micro-Nano’s MEMS Integrated Solution for 6-inch R&D and 8-inch Production
Mengru Wu , Director of the Research Planning Department of Anhui Huaxin Micro‑Nano Integrated Circuit Co., Ltd. -
13:25-13:50Advanced Packaging & Testing, Precision Sensing — Building a New Frontier in Sensor Packaging & Testing Technology
Jiegfried Gong , Sales Director of Shanghai Gongjin Microelectronics Technology Co., Ltd. -
13:50-14:15Application of Wafer Bonding in Advanced Packaging
Max Cai , CTO of Wushi Microelectronics (Suzhou) Co., Ltd. -
14:15-14:40Hangzhou Zhijiang Advanced Semiconductor Packaging Solutions
Qi Song , R&D Director of Hangzhou Zhijiang Silicone Chemicals Co., Ltd. -
14:40-14:50Tea Break & Exhibition
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14:50-15:15Microfluidics Fabrication Processes for Biomedical Applications & Introduction to the Micro/Nano-Fabrication Facility
Yanming Xia , Head of Micro/Nano-Fluidics Fabrication Facility of Guangzhou National Laboratory -
15:15-15:40Ultra-High-Precision Electron Beam Lithography for Atomic-Scale Manufacturing
Xiangqian Zhou , General Manager of Parcan Nanotech (Shanghai) Co., Ltd. -
15:40-16:05Decoupling Device Development from Capital Infrastructure: A Modular Fab Platform Approach
Mitchell Hsing , CEO & Co-Founder of InchFab Inc -
16:05-16:30Multi-Agent AI for Yield Enhancement in Advanced Semiconductor Manufacturing
Shane Sun , AI Scientist of Xuanyuan Lab of MegaRobo (Suzhou) Technology Co., Ltd. -
16:30-16:55Applications of Photomask Processes in Micro- and Nanofabrication
Yixin Tu , Chairman of Shenzhen Snsky Technoiogy Co., Ltd. -
18:00-21:00MEMS Gala (Invitation Only)
- Date: Oct. 23 Location: C1 Exhibition Hall Room 2, Suzhou International Expo Center
- Moderator: Genzi Li
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09:00-09:25MEMS LiDAR Technology and Applications
Yang Yang , Standardization Director of RoboSense (Shenzhen) Co., Ltd. -
09:25-09:50Sensing Leap: AI‑Driven Transformation — Opportunities and Future of the MEMS Industry
Sam Lu , CEO of MEMSIC -
09:50-10:15MEMS Morphology and Dynamic Microscopic Imaging Instrument: From DC to Superhigh Frequency
Lei Shao , Chief Scientist of Shanghai Microvib Precision Technology Co., Ltd. -
10:15-10:40Enhancing Spatial Intelligence with Direction of Acoustics
Wan-Thai Hsu , Chairman of the Board, Stathera, CTO of Soundskrit -
10:40-10:50Tea Break & Exhibition
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10:50-11:15AI-Driven Industrial Upgrading of Smart Sensors and Sensor Manufacturing Technology
Kun Peng , Deputy General Manager of Guangzhou Zen Semiconductor Corporation -
11:15-11:40Specialized Micro/Nano Fabrication Technologies for MEMS Devices
Yufei Liu , Process Expert of Riancen Technologies Limited -
11:40-12:05Design and Manufacture of MEMS Print-head Device
Xiaofei Zhang , General Manager of Suzhou Boyinxin Technology Co., Ltd. -
12:05-17:00Lunch & Exhibition
- Date: Oct. 23 Location: B1 Exhibition Hall Room 1, Suzhou International Expo Center
- Moderator: Xi Chu
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09:00-09:25R&D and Industrialization of OCS-MEMS Micromirror Array Chips
Qiao Chen , CEO&CTO of Suzhou Chipsensing Technology Co., Ltd. -
09:25-09:50ULVAC Etching Solutions Power Mass Production of NextGen Optical Communications in the AI Era
Peng Yu , Researcher of ULVAC Research Center SUZHOU Co., Ltd. -
09:50-10:15Silicon Photonic Integrated Chip for Computing-Centric All-Optical Interconnection
Liangjun Lu , CTO of PhotonNex Technology Co., Ltd. (Shanghai) -
10:15-10:40High-Performance Heterogeneous Bonding Technology for Silicon Photonics and Its Application in MEMS Optical Interconnects
Yao Pan , General Manager of Suzhou Mems Semiconductor Co., Ltd. -
10:40-10:50Tea Break & Exhibition
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10:50-11:15Introduction to MEMSRIGHT Thin-Film Lithium Niobate Optical Chip Process Platform
Xi Chu , R&D Director of MEMSRIGHT -
11:15-11:40MEMS Products and Development Roadmap of V-Sensor
Xianfeng Gan , Strategy Director of Wuxi V‑Sensor Technology Co., Ltd. -
11:40-12:05Development of OCS at Wuxi OCO-Link Technologies Co., Ltd.
Kevin Sun , General Manager of Wuxi OCO-Link Technologies Co., Ltd. -
12:05-17:00Lunch & Exhibition
